JPH0463148U - - Google Patents
Info
- Publication number
- JPH0463148U JPH0463148U JP10371490U JP10371490U JPH0463148U JP H0463148 U JPH0463148 U JP H0463148U JP 10371490 U JP10371490 U JP 10371490U JP 10371490 U JP10371490 U JP 10371490U JP H0463148 U JPH0463148 U JP H0463148U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- conductor circuit
- sealed
- encapsulation
- metal cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 3
- 238000005538 encapsulation Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10371490U JPH0463148U (en]) | 1990-10-02 | 1990-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10371490U JPH0463148U (en]) | 1990-10-02 | 1990-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463148U true JPH0463148U (en]) | 1992-05-29 |
Family
ID=31848692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10371490U Pending JPH0463148U (en]) | 1990-10-02 | 1990-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463148U (en]) |
-
1990
- 1990-10-02 JP JP10371490U patent/JPH0463148U/ja active Pending